Invention Application
- Patent Title: Semiconductor Device and Method
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Application No.: US17884052Application Date: 2022-08-09
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Publication No.: US20220384440A1Publication Date: 2022-12-01
- Inventor: Hsin-Yi Lee , Weng Chang , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/06 ; H01L21/02 ; H01L29/78 ; H01L29/66

Abstract:
In an embodiment, a device includes: a channel region; a gate dielectric layer on the channel region; a first work function tuning layer on the gate dielectric layer, the first work function tuning layer including a n-type work function metal; a barrier layer on the first work function tuning layer; a second work function tuning layer on the barrier layer, the second work function tuning layer including a p-type work function metal, the p-type work function metal different from the n-type work function metal; and a fill layer on the second work function tuning layer.
Public/Granted literature
- US11901362B2 Semiconductor device and method Public/Granted day:2024-02-13
Information query
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