Invention Application
- Patent Title: Method for Producing Optoelectronic Semiconductor Chips, and Optoelectronic Semiconductor Chip
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Application No.: US17765657Application Date: 2020-09-25
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Publication No.: US20220384680A1Publication Date: 2022-12-01
- Inventor: Felix Feix , Ines Pietzonka , Petrus Sundgren
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Priority: DE102019126506.1 20191001
- International Application: PCT/EP2020/076869 WO 20200925
- Main IPC: H01L33/30
- IPC: H01L33/30 ; H01L33/00 ; H01L25/075 ; H01L33/06

Abstract:
In an embodiment a method for producing optoelectronic semiconductor chips includes A) growing an AlInGaAsP semiconductor layer sequence on a growth substrate along a growth direction, wherein the semiconductor layer sequence includes an active zone for radiation generation, and wherein the active zone is composed of a plurality of alternating quantum well layers and barrier layers, B) generating a structured masking layer, C) regionally intermixing the quantum well layers and the barrier layers by applying an intermixing auxiliary through openings of the masking layer into the active zone in at least one intermixing region and D) singulating the semiconductor layer sequence into sub-regions for the semiconductor chips, wherein the barrier layers in A) are grown from [(AlxGa1-x)yIn1-y]zP1-z with x≥0.5, and wherein the quantum well layers are grown in A) from [(AlaGa1-a)bIn1-b]cP1-c with o
Public/Granted literature
- US12224379B2 Method for producing optoelectronic semiconductor chips, and optoelectronic semiconductor chip Public/Granted day:2025-02-11
Information query
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