Invention Application
- Patent Title: Electronic Devices With Multilayer Adhesive
-
Application No.: US17716911Application Date: 2022-04-08
-
Publication No.: US20220388276A1Publication Date: 2022-12-08
- Inventor: Xiaowei Wu , Hoon Sik Kim , Yuxi Zhao , Terry C Lam , Yasmin F Afsar , Chang-Chia Huang , Bhadrinarayana Lalgudi Visweswaran , Supriya Goyal , Paul S Drzaic
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: B32B7/12
- IPC: B32B7/12 ; H05K5/00 ; H05K5/03 ; C09J9/00 ; C09J7/00

Abstract:
In devices with flexible displays, multilayer adhesive stacks may be included. A multilayer adhesive may attach a flexible display panel to the display cover layer in an electronic device. Including multiple layers of adhesive in the adhesive stack (as opposed to a single layer) provides more degrees of freedom for the tuning and optimization of the properties of the adhesive stack. The multilayer adhesive stack therefore has better performance than if only a single layer of adhesive is used. The multilayer adhesive stack may include one or more layers of soft adhesive, hard adhesive, hard elastomer, hard polymer, and/or glass to optimize the mechanical and optical performance of the multilayer adhesive stack. Soft adhesive layers may be included to optimize lateral decoupling (e.g., during folding and unfolding) of the adhesive stack. Harder layers may be included to provide rigidity and prevent denting during impact events.
Public/Granted literature
- US12115771B2 Electronic devices with multilayer adhesive Public/Granted day:2024-10-15
Information query