Invention Application
- Patent Title: Bottom Fed Sublimation Bed for High Saturation Efficiency in Semiconductor Applications
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Application No.: US17367284Application Date: 2021-07-02
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Publication No.: US20230002893A1Publication Date: 2023-01-05
- Inventor: David Marquardt , Carl White , Mohith Verghese
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: C23C16/448
- IPC: C23C16/448 ; C23C16/44

Abstract:
Bottom-fed ampoules for a semiconductor manufacturing precursors and methods of use are described. The ampoules comprise an outer cylindrical wall and an inner cylindrical wall defining a flow channel in between and a bottom wall having a top surface with a plurality of concentric elongate walls, each wall comprising an opening offset from the opening in adjacent walls defining a gas exchange zone through which a carrier gas flows in contact with the precursor.
Public/Granted literature
- US11584990B2 Bottom fed sublimation bed for high saturation efficiency in semiconductor applications Public/Granted day:2023-02-21
Information query
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