Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
-
Application No.: US17672990Application Date: 2022-02-16
-
Publication No.: US20230005838A1Publication Date: 2023-01-05
- Inventor: Jaemyung CHOI , Kyoungwoo LEE , Nayon KIM , Seonghun LIM , Sungyup JUNG
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0085585 20210630
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/033 ; H01L21/768 ; H01L23/528

Abstract:
A semiconductor device includes a lower structure, a first interlayer dielectric (ILD) on the lower structure, first pattern regions extending inside the first ILD in a first direction, the first pattern regions being spaced apart from each other in a second direction perpendicular to the first direction, each of the first pattern regions including at least one first pattern, and both ends of the at least one first pattern in the first direction being concave, and second pattern regions extending inside the first ILD in the first direction, the second pattern regions being spaced apart from each other in the second direction and alternating with the first pattern regions in the second direction, and each of the second pattern regions including at least one second pattern.
Information query
IPC分类: