Invention Application
- Patent Title: METHOD AND MECHANISM FOR CONTACT-FREE PROCESS CHAMBER CHARACTERIZATION
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Application No.: US17857630Application Date: 2022-07-05
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Publication No.: US20230008072A1Publication Date: 2023-01-12
- Inventor: Vivek B. Shah , Chunlei Zhang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67
Abstract:
Disclosed herein are embodiments of a transfer chamber robot and methods of using the same. In one embodiment, a process tool for an electronic device manufacturing system comprises a transfer chamber, process chamber coupled to the transfer chamber, and a transfer chamber robot. The transfer chamber robot is configured to transfer substrates to and from the process chamber, and comprises a sensor configured to take measurements inside the process chamber.
Information query
IPC分类:
