Invention Publication
- Patent Title: SURFACE-TREATED COPPER FOIL AND COPPER CLAD LAMINATE
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Application No.: US17560283Application Date: 2021-12-23
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Publication No.: US20230144190A1Publication Date: 2023-05-11
- Inventor: Jian-Ming Huang , Yao-Sheng Lai , Jui-Chang Chou
- Applicant: CHANG CHUN PETROCHEMICAL CO., LTD.
- Applicant Address: TW TAIPEI
- Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
- Current Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
- Current Assignee Address: TW TAIPEI
- Priority: TW 0141342 2021.11.05
- Main IPC: C25D1/04
- IPC: C25D1/04 ; H05K3/02 ; H05K1/02

Abstract:
A surface-treated copper foil includes a bulk copper foil and a first surface treatment layer. The first surface treatment layer is disposed on a first surface of the bulk copper foil and includes a roughening layer, where the outermost surface of the first surface treatment layer is a treating surface of the surface-treated copper foil. The material volume (Vm) of the treating surface is 0.06 to 1.45 μm3/μm2, and the five-point peak height (S5p) of the treating surface is 0.15 to 2.00 μm.
Public/Granted literature
- US12168834B2 Surface-treated copper foil and copper clad laminate Public/Granted day:2024-12-17
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