Invention Publication
- Patent Title: MURA REDUCTION METHOD
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Application No.: US17989128Application Date: 2022-11-17
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Publication No.: US20230152684A1Publication Date: 2023-05-18
- Inventor: Douglas Joseph VAN DEN BROEKE , Chi-Ming TSAI
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: G03F1/70
- IPC: G03F1/70

Abstract:
A system, methods, and a non-transitory computer-readable medium for digital lithography to reduce mura in substrate sections. The boundary lines of the digital lithography need to be invisible. In one example, a system includes a processing unit configured to print a virtual mask file provided by a controller. The controller is configured to receive data and convert the data into a virtual mask file having an exposure pattern for a lithographic process. The exposure pattern includes a plurality of first sections, and second sections. Each first section forms a boundary with each second section along a first column of image projection systems of the processing unit. The controller patterns the substrate. The exposure pattern includes a first section pattern of each first section that crosses the eye to eye boundary with the second section making the boundary invisible.
Information query
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