Invention Publication
- Patent Title: CONNECTED PROCESSING CONTAINER AND SUBSTRATE PROCESSING METHOD
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Application No.: US17984607Application Date: 2022-11-10
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Publication No.: US20230154771A1Publication Date: 2023-05-18
- Inventor: Takayuki YAMAGISHI
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Priority: JP 21188159 2021.11.18
- Main IPC: H01L21/67
- IPC: H01L21/67

Abstract:
There is provided a connected processing container comprising: a first processing container and a second processing container arranged side by side in a horizontal direction with a gap therebetween and respectively accommodating a substrate for vacuum processing; a first block portion fixed to the first processing container; a second block portion fixed to the second processing container and arranged side by side in the horizontal direction with respect to the first block portion; and a rail portion to which the first block portion and the second block portion are slidably connected, the rail portion being provided so as to straddle the first processing container and the second processing container.
Information query
IPC分类: