Invention Publication
- Patent Title: Methods of Forming Conductive Pipes Between Neighboring Features, and Integrated Assemblies Having Conductive Pipes Between Neighboring Features
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Application No.: US18099972Application Date: 2023-01-23
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Publication No.: US20230154989A1Publication Date: 2023-05-18
- Inventor: Ahmed Nayaz Noemaun , Stephen W. Russell , Tao D. Nguyen , Santanu Sarkar
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- The original application number of the division: US15930090 2020.05.12
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/66 ; H01L21/82
Abstract:
Some embodiments include an integrated assembly having a pair of substantially parallel features spaced from one another by an intervening space. A conductive pipe is between the features and substantially parallel to the features. The conductive pipe may be formed within a tube. The tube may be generated by depositing insulative material between the features in a manner which pinches off a top region of the insulative material to leave the tube as a void region under the pinched-off top region.
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