Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US17377169Application Date: 2021-07-15
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Publication No.: US20230017013A1Publication Date: 2023-01-19
- Inventor: Meng-Wei HSIEH , Hsiu-Chi LIU
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L23/552 ; H01L21/56
Abstract:
A semiconductor package structure and a method of manufacturing the same are provided. The semiconductor package structure includes a first electronic component, a second electronic component, and a reinforcement component. The reinforcement component is disposed above the first electronic component and the second electronic component. The reinforcement component is configured to reduce warpage.
Public/Granted literature
- US11798858B2 Semiconductor package structure including reinforcement component and method for manufacturing the same Public/Granted day:2023-10-24
Information query
IPC分类:
