Invention Publication
- Patent Title: MULTILAYER CAPACITOR
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Application No.: US17720729Application Date: 2022-04-14
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Publication No.: US20230178302A1Publication Date: 2023-06-08
- Inventor: Young Soo YI , Kun Ho KOO , San KYEONG , Hai Joon LEE , Kyung Ryul LEE , Ho Yeol LEE
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20210174378 2021.12.08
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/232 ; H01G4/248 ; H01G4/008 ; H01G4/12

Abstract:
A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body to be respectively connected to the at least one first internal electrode and the at least one second internal electrode, wherein each of the first and second external electrodes includes a first conductive layer including a first conductive material and glass; and an oxide layer including an oxide and disposed on at least a portion of an external surface of the first conductive layer.
Public/Granted literature
- US11955289B2 Multilayer capacitor Public/Granted day:2024-04-09
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