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公开(公告)号：US20240274361A1
公开(公告)日：2024-08-15
申请号：US18396136
申请日：2023-12-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： San KYEONG , Ho Yeol LEE , Soung Jin KIM , Kun Hoi KOO , Hong Bum LEE , Bum Suk KANG , Kyung Ryul LEE , Hae Suk CHUNG
CPC classification number: H01G4/2325 , H01G4/30 , H01G4/0085 , H01G4/1227
Abstract: A multilayer electronic component according to an example embodiment of the present disclosure includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer disposed on the body and connected to an internal electrode and including Cu and glass, and a plating layer disposed on the electrode layer, at least a portion of the Cu and at least a portion of the glass are disposed adjacent to the plating layer, and an oxide including Cu is disposed on at least a portion of Cu and at least a portion of the glass disposed adjacent to the plating layer.
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公开(公告)号：US20230187137A1
公开(公告)日：2023-06-15
申请号：US17833165
申请日：2022-06-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： San KYEONG , Young Soo YI , Kun Ho KOO , Soung Jin KIM , Ho Yeol LEE , Kyung Ryul LEE , Chang Hak CHOI
CPC classification number: H01G4/2325 , H01G4/30
Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes stacked in a first direction and having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and connected to the first and second internal electrodes, respectively. The first and second external electrodes each include a central portion disposed in a center of each of the third and fourth surfaces and an outer portion disposed outside the central portion. T1>T2>T3, in which T1 and T3 are maximum value and minimum value of a thickness of the central portion, respectively, and T2 is a maximum value of a thickness of the outer portion.
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公开(公告)号：US20230178302A1
公开(公告)日：2023-06-08
申请号：US17720729
申请日：2022-04-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Soo YI , Kun Ho KOO , San KYEONG , Hai Joon LEE , Kyung Ryul LEE , Ho Yeol LEE
Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body to be respectively connected to the at least one first internal electrode and the at least one second internal electrode, wherein each of the first and second external electrodes includes a first conductive layer including a first conductive material and glass; and an oxide layer including an oxide and disposed on at least a portion of an external surface of the first conductive layer.
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公开(公告)号：US20200058442A1
公开(公告)日：2020-02-20
申请号：US16156911
申请日：2018-10-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kyoung Jin CHA , Jeong Ryeol KIM , Kyung Ryul LEE , Young Joon OH , Hyo Min KANG , Jun Oh KIM
Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet, forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. The content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder.
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Patent Agency Ranking
公开(公告)号：US20230343514A1
公开(公告)日：2023-10-26
申请号：US18072913
申请日：2022-12-01
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kun Ho KOO , San KYEONG , Soung Jin KIM , Young Soo YI , Ho Yeol LEE , Ic Seob KIM , Kyung Ryul LEE , Chang Hak CHOI
Abstract: A conductive paste includes: conductive powder containing Cu particles; and a glass frit including an oxide containing alkali metal, wherein a content of the alkali metal is 0.16 wt% or more and 0.35 wt% or less with respect to a total content of the Cu particles.
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公开(公告)号：US20170011850A1
公开(公告)日：2017-01-12
申请号：US15071821
申请日：2016-03-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hong Seok KIM , Chung Eun LEE , Doo Young KIM , Ki Han KIM , Ji Ye CHOI , Kyung Ryul LEE , Jae Yeol CHOI , Soo Kyong JO
CPC classification number: H01G4/08 , H01G4/0085 , H01G4/012 , H01G4/1227 , H01G4/248 , H01G4/30
Abstract: A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.
Abstract translation: 多层陶瓷电子部件包括交替配置电介质层和内部电极的陶瓷体。 陶瓷 - 金属化合物层设置在内部电极和电介质层之间的界面上。 此外，在一些示例中，相邻内部电极之间的空间被电介质层完全占据，并且电介质层含有含有金属颗粒的陶瓷 - 金属化合物。 陶瓷 - 金属化合物层可以具有压花型构型或枝晶型构型。
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公开(公告)号：US20220189696A1
公开(公告)日：2022-06-16
申请号：US17490039
申请日：2021-09-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Soo YI , Soung Jin KIM , Kun Hoi KOO , Jun Hyeon KIM , Kyung Ryul LEE
Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.
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公开(公告)号：US20220122770A1
公开(公告)日：2022-04-21
申请号：US17320958
申请日：2021-05-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Woong Do JUNG , Yu Hong OH , Kyung Ryul LEE , Kun Ho KOO , Young Soo YI
Abstract: A multilayer electronic component includes a body in which internal electrodes including Ni and Sn and dielectric layers are alternately disposed, and external electrodes disposed on a surface of the body, connected to the internal electrodes, and including Cu and Sn, wherein the internal electrodes include an alloy including Ni, Cu, and Sn in a region in contact with the external electrodes, and Sn in an amount that satisfies the following formula: 1
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公开(公告)号：US20190304695A1
公开(公告)日：2019-10-03
申请号：US16050560
申请日：2018-07-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jeong Ryeol KIM , Hyo Sub KIM , Kyung Ryul LEE , Jun Oh KIM , Beom Seock OH , Jong Han KIM , Kyoung Jin CHA
Abstract: A multilayer capacitor includes: a body including dielectric layers and internal electrodes alternately disposed therein; and external electrodes disposed on the body and connected to the internal electrodes, respectively. Each of the internal electrodes includes a Ni grain, ceramics distributed in the Ni grain, a first coating layer surrounding the Ni grain, and second coating layers surrounding the ceramics.
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