Invention Publication
- Patent Title: FOAM MOLDING COMPOSITION, FOAM MOLDED BODY, ELECTRIC WIRE, METHOD FOR PRODUCING FOAM MOLDED BODY AND METHOD FOR PRODUCING ELECTRIC WIRE
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Application No.: US18163498Application Date: 2023-02-02
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Publication No.: US20230183450A1Publication Date: 2023-06-15
- Inventor: Hideki KOUNO , Kenji ISHII , Masato TOKUDA , Takahiro KITAHARA
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Priority: JP 20132040 2020.08.03
- Main IPC: C08K5/521
- IPC: C08K5/521 ; C08L81/04 ; C08L61/18 ; C08J9/12 ; C09D181/04 ; C09D161/18 ; B32B15/04 ; B32B5/18 ; H01B7/02 ; H01B3/30 ; H01B13/06

Abstract:
A foam molding composition from which a foam molded body and a foamed electric wire can be produced having excellent heat resistance, a small average cell size, a high foaming ratio, and good outer diameter stability. The foam molding composition includes a resin (A) having a pyrolysis temperature of 330° C. or higher and at least one compound (B) selected from phosphoric acid esters and salts thereof and phosphoric acid ester complex compounds. Also disclosed is a foam molded body obtained from the foam molding composition, an electric wire including a core wire and a covering material covering the core wire obtained from the foam molding composition, and a method for producing the foam molded body.
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