A multilayer ceramic electronic component includes a multilayer body including ceramic layers that are laminated, first and second internal electrode layers respectively on the ceramic layers and exposed to first and second end surfaces, first and second external electrodes respectively connected to the first and second internal electrode layers. The first and second external electrodes include a base electrode layer including at least one of Ni, Cr, Cu, or Ti and a plating layer including lower, middle, and upper layer plating layers. A particle diameter of a metal included in the lower layer plating layer is larger than a particle diameter of a metal included in the middle layer plating layer.