公开(公告)号：US20230095128A1

公开(公告)日：2023-03-30

申请号：US18075456

申请日：2022-12-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoshi MURAMATSU ,  Ken TOMINAGA

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/008

Abstract: A multilayer ceramic capacitor includes an external electrode including an underlying electrode layer, a lower plating layer on the underlying electrode layer at a first end surface and a second end surface, and an upper plating layer on the lower plating layer. The underlying electrode layer is a thin film electrode including at least one selected from Ni, Cr, Cu, and Ti. The lower plating layer is a Cu plating layer including a lower layer region located closer to the multilayer body and an upper layer region located between the lower layer region and the upper plating layer, and the Cu plating layer in the lower layer region has a metal grain diameter smaller than that of the Cu plating layer located in the upper layer region.

公开(公告)号：US20240153712A1

公开(公告)日：2024-05-09

申请号：US18410081

申请日：2024-01-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoshi MURAMATSU ,  Ken TOMINAGA

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

Abstract: A multilayer ceramic capacitor includes an external electrode including an underlying electrode layer, a lower plating layer on the underlying electrode layer at a first end surface and a second end surface, and an upper plating layer on the lower plating layer. The underlying electrode layer is a thin film electrode including at least one selected from Ni, Cr, Cu, and Ti. The lower plating layer is a Cu plating layer including a lower layer region located closer to the multilayer body and an upper layer region located between the lower layer region and the upper plating layer, and the Cu plating layer in the lower layer region has a metal grain diameter smaller than that of the Cu plating layer located in the upper layer region.

公开(公告)号：US20210327649A1

公开(公告)日：2021-10-21

申请号：US17205069

申请日：2021-03-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Satoshi MURAMATSU ,  Ken TOMINAGA

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/232 ,  H01G4/12

Abstract: A multilayer ceramic capacitor includes an external electrode including an underlying electrode layer, a lower plating layer on the underlying electrode layer at a first end surface and a second end surface, and an upper plating layer on the lower plating layer. The underlying electrode layer is a thin film electrode including at least one selected from Ni, Cr, Cu, and Ti. The lower plating layer is a Cu plating layer including a lower layer region located closer to the multilayer body and an upper layer region located between the lower layer region and the upper plating layer, and the Cu plating layer in the lower layer region has a metal grain diameter smaller than that of the Cu plating layer located in the upper layer region.

公开(公告)号：US20250104921A1

公开(公告)日：2025-03-27

申请号：US18976534

申请日：2024-12-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ken TOMINAGA

IPC: H01G4/232 ,  H01G4/30

Abstract: A multilayer ceramic electronic component includes a multilayer body, first and second outer electrodes respectively extending from first and second end surfaces of the multilayer body to each of first and second main surfaces. The first outer electrode includes a first main surface inclined portion extending from the first main surface side of the multilayer body to the first end surface side. The second outer electrode includes a second main surface inclined portion extending from the first main surface side of the multilayer body to the second end surface side. The first main surface inclined portion covers a ridge portion defined by the first main surface and the first end surface of the multilayer body. The second main surface inclined portion covers a ridge portion defined by the first main surface and the second end surface of the multilayer body.

公开(公告)号：US20230018369A1

公开(公告)日：2023-01-19

申请号：US17848434

申请日：2022-06-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ken TOMINAGA ,  Satoshi MURAMATSU

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12 ,  H01G2/06

Abstract: A multilayer ceramic electronic component includes a multilayer body including ceramic layers that are laminated, first and second internal electrode layers respectively on the ceramic layers and exposed to first and second end surfaces, first and second external electrodes respectively connected to the first and second internal electrode layers. The first and second external electrodes include a base electrode layer including at least one of Ni, Cr, Cu, or Ti and a plating layer including lower, middle, and upper layer plating layers. A particle diameter of a metal included in the lower layer plating layer is larger than a particle diameter of a metal included in the middle layer plating layer.