- 专利标题: METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND COATING SYSTEM FOR IMPLEMENTING THE METHOD
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申请号: US17811707申请日: 2022-07-11
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公开(公告)号: US20230019554A1公开(公告)日: 2023-01-19
- 发明人: Yuji KADOWAKI , Tomomi KANO
- 申请人: IBIDEN CO., LTD.
- 申请人地址: JP Ogaki
- 专利权人: IBIDEN CO., LTD.
- 当前专利权人: IBIDEN CO., LTD.
- 当前专利权人地址: JP Ogaki
- 优先权: JP2021-116319 20210714
- 主分类号: H05K3/02
- IPC分类号: H05K3/02 ; H05K3/00 ; C25D5/02 ; C25D5/22 ; C25D5/54 ; C25D7/00
摘要:
A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying liquid resist on the seed layer formed on the surface of the resin insulating layer, drying the liquid resist applied on the seed layer such that a resist layer is formed on the seed layer, applying pressure and heat simultaneously to an entire surface of the resist layer formed on the seed layer, forming a plating resist on the seed layer from the resist layer formed on the seed layer using a photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the plating resist, removing the plating resist from the seed layer, and removing part of the seed layer exposed from the electrolytic plating film.