公开(公告)号：US20230019554A1

公开(公告)日：2023-01-19

申请号：US17811707

申请日：2022-07-11

申请人： IBIDEN CO., LTD.

发明人： Yuji KADOWAKI ,  Tomomi KANO

IPC分类号： H05K3/02 ,  H05K3/00 ,  C25D5/02 ,  C25D5/22 ,  C25D5/54 ,  C25D7/00

摘要： A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying liquid resist on the seed layer formed on the surface of the resin insulating layer, drying the liquid resist applied on the seed layer such that a resist layer is formed on the seed layer, applying pressure and heat simultaneously to an entire surface of the resist layer formed on the seed layer, forming a plating resist on the seed layer from the resist layer formed on the seed layer using a photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the plating resist, removing the plating resist from the seed layer, and removing part of the seed layer exposed from the electrolytic plating film.

公开(公告)号：US20240188228A1

公开(公告)日：2024-06-06

申请号：US18441702

申请日：2024-02-14

申请人： IBIDEN CO., LTD.

发明人： Yuji KADOWAKI ,  Tomomi KANO

IPC分类号： H05K3/46 ,  H05K3/10 ,  H05K3/14

CPC分类号： H05K3/4629 ,  H05K3/106 ,  H05K3/108 ,  H05K3/143 ,  H05K3/4602 ,  H05K2203/0143 ,  H05K2203/0235 ,  H05K2203/065 ,  H05K2203/068 ,  H05K2203/08

摘要： A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.

公开(公告)号：US20220304166A1

公开(公告)日：2022-09-22

申请号：US17679525

申请日：2022-02-24

申请人： IBIDEN CO., LTD.

发明人： Yuji KADOWAKI ,  Tomomi KANO

IPC分类号： H05K3/46 ,  H05K3/10

摘要： A method for manufacturing a printed wiring board includes forming a seed layer on a surface of a resin insulating layer, applying a dry film onto the seed layer using a laminating roll device, cutting the dry film applied onto the seed layer to a predetermined size, applying pressure and heat to the dry film, forming a plating resist on the seed layer from the dry film using photographic technology, forming an electrolytic plating film on part of the seed layer exposed from the resist, removing the resist from the seed layer, and removing the part of the seed layer exposed from the electrolytic plating film. The applying of the pressure and heat includes applying the pressure and heat to the dry film applied onto the seed layer such that the pressure and heat are applied to the entire surface of the dry film cut to the predetermined size simultaneously.