Invention Publication
- Patent Title: INTEGRATED CIRCUIT CHIP VERIFICATION METHOD AND APPARATUS, ELECTRONIC DEVICE, AND STORAGE MEDIUM
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Application No.: US17864714Application Date: 2022-07-14
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Publication No.: US20230195945A1Publication Date: 2023-06-22
- Inventor: Yan LI
- Applicant: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
- Current Assignee: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing
- Priority: CN 2111571211.7 2021.12.21
- Main IPC: G06F21/76
- IPC: G06F21/76 ; G06F7/483

Abstract:
The present disclosure provides an integrated circuit (IC) chip verification method and apparatus, an electronic device, and a storage medium, and relates to the field of artificial intelligence such as artificial intelligence chips and cloud computing. The method may include: acquiring a first parameter and a second parameter, the first parameter being an upper limit of a required floating-point number, and the second parameter being a lower limit of the required floating-point number; generating a first sign, a first exponent, and a first fraction of a randomized floating-point number respectively according to the first parameter and the second parameter; generating the floating-point number according to the first sign, the first exponent, and the first fraction; and performing IC chip verification by using the floating-point number.
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