Invention Application
- Patent Title: INTEGRATED SEPARATOR DEVICES FOR HARDWARE COMPONENT SEPARATION
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Application No.: US17956598Application Date: 2022-09-29
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Publication No.: US20230019643A1Publication Date: 2023-01-19
- Inventor: Daniel Neumann , Andrew Larson , Eric Buddrius , Jeffory Smalley , Shelby Ferguson
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H05K5/02
- IPC: H05K5/02

Abstract:
Example integrated separator devices for hardware component separation are disclosed herein. An example apparatus include a processor carrier having an inner edge and an outer edge; and a component separator rotatably coupled to the processor carrier, the component separator including a shaft, an entirety of the component separator closer to a center of the processor carrier than the outer edge is to the center of the processor carrier.
Information query