公开(公告)号：US10455685B1

公开(公告)日：2019-10-22

申请号：US16159840

申请日：2018-10-15

Applicant: Intel Corporation

Inventor： Steven A. Klein ,  Kuang Liu ,  Thomas A. Boyd ,  Luis Gil Rangel ,  Muffadal Mukadem ,  Shelby A. Ferguson ,  Francis Toth, Jr. ,  Eric Buddrius ,  Ralph V. Miele ,  Sriram Srinivasan ,  Jeffory L. Smalley

IPC: H01L23/522 ,  H01L23/485 ,  H01L23/32 ,  H05K1/02 ,  H05K3/30 ,  H01R12/70 ,  H05K7/10 ,  H01L23/367 ,  H05K3/36

Abstract: An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.

公开(公告)号：US20250112392A1

公开(公告)日：2025-04-03

申请号：US18980411

申请日：2024-12-13

Applicant: Intel Corporation

Inventor： Richard Canham ,  Ernesto Borboa Lizarraga ,  Daniel Neumann ,  Shelby Ferguson ,  Eric Buddrius ,  Hardikkumar Prajapati ,  Kirk Wheeler ,  Steven Klein ,  Shaun Immeker ,  Jeffory L. Smalley

IPC: H01R12/85

Abstract: A semiconductor package carrier used to support a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) as the semiconductor package is moved from a shipping tray to a land grid array (LGA) socket during assembly of an electronic device. The semiconductor package carrier including a carrier body including a plurality of support structures arranged to support a portion of the semiconductor package. The semiconductor package carrier further including a locking structure moveable between a first position and a second position, wherein the first position allows the support structures to receive the semiconductor package and the second position secures the semiconductor package to the carrier body. In some embodiments, the semiconductor package carrier may also include a thermal interface material (TIM) breaker to facilitate removal of a heatsink from the semiconductor package. Other embodiments are described and claimed.

公开(公告)号：US20230027076A1

公开(公告)日：2023-01-26

申请号：US17956612

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Andres Ramirez Macias ,  Eric Buddrius ,  Jeffory Smalley ,  Fernando Gonzalez Lenero ,  Francisco Javier Colorado Alonso ,  Fatima Elias Flores ,  Rolf Laido

IPC: H01L23/40 ,  H01L21/48 ,  H05K7/10 ,  H05K7/14 ,  H05K7/20

Abstract: Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.

公开(公告)号：US20230019643A1

公开(公告)日：2023-01-19

申请号：US17956598

申请日：2022-09-29

Applicant: Intel Corporation

Inventor： Daniel Neumann ,  Andrew Larson ,  Eric Buddrius ,  Jeffory Smalley ,  Shelby Ferguson

IPC: H05K5/02

Abstract: Example integrated separator devices for hardware component separation are disclosed herein. An example apparatus include a processor carrier having an inner edge and an outer edge; and a component separator rotatably coupled to the processor carrier, the component separator including a shaft, an entirety of the component separator closer to a center of the processor carrier than the outer edge is to the center of the processor carrier.