公开(公告)号：US10455685B1

公开(公告)日：2019-10-22

申请号：US16159840

申请日：2018-10-15

申请人： Intel Corporation

发明人： Steven A. Klein ,  Kuang Liu ,  Thomas A. Boyd ,  Luis Gil Rangel ,  Muffadal Mukadem ,  Shelby A. Ferguson ,  Francis Toth, Jr. ,  Eric Buddrius ,  Ralph V. Miele ,  Sriram Srinivasan ,  Jeffory L. Smalley

IPC分类号： H01L23/522 ,  H01L23/485 ,  H01L23/32 ,  H05K1/02 ,  H05K3/30 ,  H01R12/70 ,  H05K7/10 ,  H01L23/367 ,  H05K3/36

摘要： An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.

公开(公告)号：US20230027076A1

公开(公告)日：2023-01-26

申请号：US17956612

申请日：2022-09-29

申请人： Intel Corporation

发明人： Andres Ramirez Macias ,  Eric Buddrius ,  Jeffory Smalley ,  Fernando Gonzalez Lenero ,  Francisco Javier Colorado Alonso ,  Fatima Elias Flores ,  Rolf Laido

IPC分类号： H01L23/40 ,  H01L21/48 ,  H05K7/10 ,  H05K7/14 ,  H05K7/20

摘要： Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages are disclosed. An example apparatus includes a carrier plate including a first surface to face a heatsink; a second surface opposite the first surface, and an aperture extending between the first and second surfaces, the aperture dimensioned to surround a semiconductor device, and a spring carried by the carrier plate, the spring to contact a surface of the semiconductor device proximate an outer edge of the semiconductor device.

公开(公告)号：US20230019643A1

公开(公告)日：2023-01-19

申请号：US17956598

申请日：2022-09-29

申请人： Intel Corporation

发明人： Daniel Neumann ,  Andrew Larson ,  Eric Buddrius ,  Jeffory Smalley ,  Shelby Ferguson

IPC分类号： H05K5/02

摘要： Example integrated separator devices for hardware component separation are disclosed herein. An example apparatus include a processor carrier having an inner edge and an outer edge; and a component separator rotatably coupled to the processor carrier, the component separator including a shaft, an entirety of the component separator closer to a center of the processor carrier than the outer edge is to the center of the processor carrier.