Invention Publication
- Patent Title: GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CONTACT SELF-ALIGNED TO EPITAXIAL SOURCE
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Application No.: US17556614Application Date: 2021-12-20
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Publication No.: US20230197714A1Publication Date: 2023-06-22
- Inventor: Guillaume BOUCHE , Aryan NAVABI-SHIRAZI , Andy Chih-Hung WEI , Mauro J. KOBRINSKY , Shaun MILLS , Pratik PATEL
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L27/12 ; H01L29/40

Abstract:
Gate-all-around integrated circuit structures having backside contact self-aligned to epitaxial source or drain region are described. For example, an integrated circuit structure includes a first vertical arrangement of nanowires and a second vertical arrangement of nanowires. A gate stack is over the first and second vertical arrangements of nanowires. First epitaxial source or drain structures are at ends of the first vertical arrangement of nanowires. Second epitaxial source or drain structures are at ends of the second vertical arrangement of nanowires. A conductive structure is vertically beneath and in contact with one of the first epitaxial source or drain structures.
Information query
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