Invention Publication
- Patent Title: METHODS, DEVICES, AND SYSTEMS RELATED TO FORMING SEMICONDUCTOR POWER DEVICES WITH A HANDLE SUBSTRATE
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Application No.: US18168354Application Date: 2023-02-13
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Publication No.: US20230197788A1Publication Date: 2023-06-22
- Inventor: Martin F. Schubert , Vladimir Odnoblyudov , Cem Basceri
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L21/683 ; H01L29/778 ; H01L29/06 ; H01L27/06 ; H01L29/66 ; H01L29/423
Abstract:
Methods of manufacturing device assemblies, as well as associated semiconductor assemblies, devices, systems are disclosed herein. In one embodiment, a method of forming a semiconductor device assembly includes forming a semiconductor device assembly that includes a handle substrate, a semiconductor structure having a first side and a second side opposite the first side, and an intermediary material between the semiconductor structure and the handle substrate. The method also includes removing material from the semiconductor structure to form an opening extending from the first side of the semiconductor structure to at least the intermediary material at the second side of the semiconductor structure. The method further includes removing at least a portion of the intermediary material through the opening in the semiconductor structure to undercut the second side of the semiconductor structure.
Information query
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