- 专利标题： METHOD OF DEPOSITING A MATERIAL
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申请号： US17776777申请日： 2020-11-13
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公开(公告)号： US20230220539A1公开(公告)日： 2023-07-13
- 发明人: Michael Edward RENDALL , Robert Ian Joseph GRUAR
- 申请人： Dyson Technology Limited
- 申请人地址： GB Wiltshire
- 专利权人： Dyson Technology Limited
- 当前专利权人： Dyson Technology Limited
- 当前专利权人地址： GB Wiltshire
- 优先权： GB 16628.9 2019.11.15
- 国际申请： PCT/GB2020/052892 2020.11.13
- 进入国家日期： 2022-05-13
- 主分类号： C23C14/34
- IPC分类号： C23C14/34 ; C23C14/14 ; C23C14/06 ; C23C14/08 ; C23C14/56 ; C23C14/02 ; H01G9/00 ; H01F41/18 ; H01L33/00 ; H01L33/50 ; H01L31/032 ; H01J37/34
摘要：
A method of manufacturing an electronic component including a substrate is provided. The method includes generating a plasma remote from a sputter target, generating sputtered material from the sputter target using the plasma, and depositing the sputtered material on a substrate as a crystalline layer.
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