Invention Publication
- Patent Title: Sensor Module, Measurement System, And Vehicle
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Application No.: US18302453Application Date: 2023-04-18
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Publication No.: US20230251282A1Publication Date: 2023-08-10
- Inventor: Taketo CHINO , Yoshikuni SAITO , Nobuyuki IMAI
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 18050849 2018.03.19
- The original application number of the division: US16356192 2019.03.18
- Main IPC: G01P15/18
- IPC: G01P15/18 ; G01P15/125 ; G01P15/08 ; G01C21/16

Abstract:
A sensor module includes an X-axis angular velocity sensor device that outputs digital X-axis angular velocity data, a Y-axis angular velocity sensor device that outputs digital Y-axis angular velocity data, a Z-axis angular velocity sensor device that outputs digital Z-axis angular velocity data, an acceleration sensor device that outputs digital X-axis, Y-axis, and Z-axis acceleration data, a microcontroller, a first digital interface bus that electrically connects the X-axis angular velocity sensor device, the Y-axis angular velocity sensor device, and the Z-axis angular velocity sensor device to a first digital interface, and a second digital interface bus that electrically connects the acceleration sensor device to a second digital interface.
Public/Granted literature
- US12153066B2 Sensor module, measurement system, and vehicle Public/Granted day:2024-11-26
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