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公开(公告)号：US20250138043A1
公开(公告)日：2025-05-01
申请号：US18931495
申请日：2024-10-30
Applicant: SEIKO EPSON CORPORATION
Inventor： Taketo CHINO
Abstract: A sensor module includes a first substrate, a second substrate, a connection portion, a first sensor device, and a second sensor device. The connection portion forms an electrical connection between the first substrate and the second substrate. The first sensor device is disposed on the first substrate to detect a physical quantity on a first axis. The second sensor device is disposed on the second substrate to detect a physical quantity on the first axis.
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公开(公告)号：US20240302191A1
公开(公告)日：2024-09-12
申请号：US18665987
申请日：2024-05-16
Applicant: SEIKO EPSON CORPORATION
Inventor： Masayasu SAKUMA , Yoshihiro KOBAYASHI , Shojiro KITAMURA , Taketo CHINO
CPC classification number: G01D11/245 , G01C19/5769 , G01C21/166 , H01R12/72 , H05K1/148 , G01D11/30 , H05K2201/09163
Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
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公开(公告)号：US20160109238A1
公开(公告)日：2016-04-21
申请号：US14982700
申请日：2015-12-29
Applicant: Seiko Epson Corporation
Inventor： Masayasu SAKUMA , Yoshihiro KOBAYASHI , Shojiro KITAMURA , Taketo CHINO , Nobuyuki IMAI
IPC: G01C19/5783 , G01P15/02 , G01P1/00
CPC classification number: G01C19/5783 , G01P1/00 , G01P15/02 , G01P15/097 , G01P15/18
Abstract: A sensor device includes a mounting board having a first rigid board on which an angular velocity sensor is mounted and a third rigid board on which an angular velocity sensor is mounted, and a pedestal for fixing the mounting board. Further, the pedestal includes a base section having a first fixation surface along an x axis and a y axis, and projecting sections disposed on the base section, and having a second fixation surface along the x axis and a z axis, and a third fixation surface along the y axis and the z axis, each of the rigid boards is supported by at least two of the first fixation surface, the second fixation surface, and the third fixation surface, and the angular velocity sensors have respective detection axes intersecting with each other.
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公开(公告)号：US20150122020A1
公开(公告)日：2015-05-07
申请号：US14596853
申请日：2015-01-14
Applicant: Seiko Epson Corporation
Inventor： Masayasu SAKUMA , Yoshihiro KOBAYASHI , Shojiro KITAMURA , Taketo CHINO
IPC: G01D11/24
CPC classification number: G01D11/245 , G01C19/5769 , G01C21/16 , G01D11/30
Abstract: A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.
Abstract translation: 传感器装置包括具有固定表面的安装构件和至少一个直接或间接地固定到安装构件的固定表面的电子部件，并且安装构件构成用于容纳电子部件的壳体的一部分。 此外，固定面彼此垂直。
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公开(公告)号：US20250164521A1
公开(公告)日：2025-05-22
申请号：US18954947
申请日：2024-11-21
Applicant: SEIKO EPSON CORPORATION
Inventor： Taketo CHINO , Ryohei OZAWA
Abstract: A sensor module includes a first substrate, a second substrate, and a connection portion forming a connection between the first substrate and the second substrate. The first substrate is provided with a first sensor device configured to detect a physical quantity on a first axis, a second sensor device configured to detect a physical quantity on a second axis, and a third sensor device configured to detect a physical quantity on a third axis. The second substrate is provided with a fourth sensor device configured to detect a physical quantity on the first axis, a fifth sensor device configured to detect a physical quantity on the second axis, and a sixth sensor device configured to detect a physical quantity on the third axis.
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Patent Agency Ranking
公开(公告)号：US20230251282A1
公开(公告)日：2023-08-10
申请号：US18302453
申请日：2023-04-18
Applicant: SEIKO EPSON CORPORATION
Inventor： Taketo CHINO , Yoshikuni SAITO , Nobuyuki IMAI
IPC: G01P15/18 , G01P15/125 , G01P15/08 , G01C21/16
CPC classification number: G01P15/18 , G01P15/125 , G01P15/0888 , G01C21/183 , G01C19/56
Abstract: A sensor module includes an X-axis angular velocity sensor device that outputs digital X-axis angular velocity data, a Y-axis angular velocity sensor device that outputs digital Y-axis angular velocity data, a Z-axis angular velocity sensor device that outputs digital Z-axis angular velocity data, an acceleration sensor device that outputs digital X-axis, Y-axis, and Z-axis acceleration data, a microcontroller, a first digital interface bus that electrically connects the X-axis angular velocity sensor device, the Y-axis angular velocity sensor device, and the Z-axis angular velocity sensor device to a first digital interface, and a second digital interface bus that electrically connects the acceleration sensor device to a second digital interface.
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公开(公告)号：US20190283732A1
公开(公告)日：2019-09-19
申请号：US16356012
申请日：2019-03-18
Applicant: Seiko Epson Corporation
Inventor： Fumikazu OTANI , Yoshikuni SAITO , Taketo CHINO , Nobuyuki IMAI
Abstract: A sensor module includes a first sensor device, a second sensor device, and a microcontroller. The first sensor device includes a first synchronization terminal to which an external synchronization signal or a synchronization signal which is a signal based on the external synchronization signal is input, a first interface outputs first measurement data to the microcontroller on the basis of the synchronization signal which is input to the first synchronization terminal, the second sensor device includes a second synchronization terminal to which the synchronization signal is input, and a second interface outputs second measurement data to the microcontroller on the basis of the synchronization signal which is input to the second synchronization terminal.
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公开(公告)号：US20150096372A1
公开(公告)日：2015-04-09
申请号：US14501583
申请日：2014-09-30
Applicant: Seiko Epson Corporation
Inventor： Masayasu SAKUMA , Taketo CHINO
Abstract: A sensor unit includes a sensor and a mount board on which the sensor is mounted. The mount board includes a mount terminal connected to a terminal provided in the sensor and a wiring extending from the mount terminal. The wiring is not provided in a region where the sensor and the mount board overlap each other when viewed in plan.
Abstract translation: 传感器单元包括安装传感器的传感器和安装板。 安装板包括连接到设置在传感器中的端子的安装端子和从安装端子延伸的布线。 当在平面图中观察时，传感器和安装板彼此重叠的区域中不设置布线。
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公开(公告)号：US20240093997A1
公开(公告)日：2024-03-21
申请号：US18467235
申请日：2023-09-14
Applicant: SEIKO EPSON CORPORATION
Inventor： Taketo CHINO , Yoshiyuki MATSUURA
IPC: G01C19/5783 , G01P1/02 , G01P15/18
CPC classification number: G01C19/5783 , G01P1/023 , G01P15/18
Abstract: An inertial measurement device includes: a board; a first inertial sensor configured to detect a physical quantity of a first axis and disposed perpendicular to the board; a rigid case configured to cover the first inertial sensor; and a filling material disposed between the first inertial sensor and the case.
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公开(公告)号：US20230236014A1
公开(公告)日：2023-07-27
申请号：US18158066
申请日：2023-01-23
Applicant: SEIKO EPSON CORPORATION
Inventor： Taketo CHINO
IPC: G01C21/16
CPC classification number: G01C21/16
Abstract: An inertial sensor module includes: a plurality of inertial sensors including a first inertial sensor and a second inertial sensor that have different detection ranges; a processing unit configured to process detection signals of the plurality of inertial sensors and output inertial outputs; a transmission unit configured to transmit the inertial outputs to a host; and a reception unit configured to receive processing information from the host. The processing unit is configured to process at least one of the detection signals of the plurality of inertial sensors according to the received processing information.
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