An interconnect board assembly includes a busbar assembly with at least one track having a plurality of busbars. The interconnect board assembly may be used with a power module having a plurality of battery cells. The interconnect board assembly includes a senseline assembly having a plurality of traces extending in proximity to the at least one track. An overmolded board frame is integrally formed over the busbar assembly and the senseline assembly. The overmolded board frame defines a first surface and a second surface. The overmolded board frame is configured such that a rigid load path is completed when the busbar assembly is joined to the senseline assembly and the plurality of battery cells.