OVERMOLDED INTERCONNECT BOARD ASSEMBLY FOR POWER MODULE

    公开(公告)号:US20230253679A1

    公开(公告)日:2023-08-10

    申请号:US17665714

    申请日:2022-02-07

    摘要: An interconnect board assembly includes a busbar assembly with at least one track having a plurality of busbars. The interconnect board assembly may be used with a power module having a plurality of battery cells. The interconnect board assembly includes a senseline assembly having a plurality of traces extending in proximity to the at least one track. An overmolded board frame is integrally formed over the busbar assembly and the senseline assembly. The overmolded board frame defines a first surface and a second surface. The overmolded board frame is configured such that a rigid load path is completed when the busbar assembly is joined to the senseline assembly and the plurality of battery cells.

    FINGERPROOF TERMINAL ARRANGEMENT FOR HIGH-VOLTAGE APPLICATIONS

    公开(公告)号:US20230402726A1

    公开(公告)日:2023-12-14

    申请号:US17836938

    申请日:2022-06-09

    IPC分类号: H01M50/545 H01M50/552

    CPC分类号: H01M50/545 H01M50/552

    摘要: A terminal arrangement for high-voltage batteries is disclosed. The terminal arrangement includes a substrate having concentric generally tubular inner and outer walls extending from an upper surface of the substrate, with an annular terminal disposed on the upper surface between the inner and outer walls. The inner and outer walls have respective inner and outer heights above a top surface of the annular terminal and the annular terminal has a radial span between the inner and outer walls, wherein the inner and outer heights and the radial span are sized so as to preclude human fingertips above a predetermined size from touching the annular terminal.