- 专利标题： MULTI-MODAL FLOW BALANCING FOR POWER SEMICONDUCTOR MODULE COOLING
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申请号： US18110363申请日： 2023-02-15
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公开(公告)号： US20230260874A1公开(公告)日： 2023-08-17
- 发明人: George R. Woody , David L. Bogdanchik , Alden C. McLean
- 申请人： George R. Woody , David L. Bogdanchik , Alden C. McLean
- 申请人地址： US AR Clinton
- 专利权人： George R. Woody,David L. Bogdanchik,Alden C. McLean
- 当前专利权人： George R. Woody,David L. Bogdanchik,Alden C. McLean
- 当前专利权人地址： US AR Clinton
- 主分类号： H01L23/473
- IPC分类号： H01L23/473
摘要：
A high performance, low-profile semiconductor heat dissipation apparatus that is able to achieve increased heat dissipation efficiency, greater heat dissipation uniformity, and greater heat dissipation control through the use of multiple modes of innovative coolant fluid flow balancing.
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