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公开(公告)号：US20190139862A1
公开(公告)日：2019-05-09
申请号：US15787711
申请日：2017-10-19
IPC分类号： H01L23/473 , H01L23/367 , H01L25/11
摘要： An improved heat dissipation apparatus for limiting the temperature of multiple power semiconductors featuring flow balancers to manipulate the hydrodynamic pressure of the coolant fluid to regulate the coolant fluid flow distribution across the heat exchange fins to either create uniform flow distribution or purposefully disproportionate or custom coolant fluid flow distribution for the purpose of achieving higher heat transfer efficiency.
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公开(公告)号：US10892208B2
公开(公告)日：2021-01-12
申请号：US15787711
申请日：2017-10-19
IPC分类号： H01L23/473 , H01L23/367 , H01L25/11 , H01L23/40
摘要： An improved heat dissipation apparatus for limiting the temperature of multiple power semiconductors featuring flow balancers to manipulate the hydrodynamic pressure of the coolant fluid to regulate the coolant fluid flow distribution across the heat exchange fins to either create uniform flow distribution or purposefully disproportionate or custom coolant fluid flow distribution for the purpose of achieving higher heat transfer efficiency.
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公开(公告)号：US20240291183A1
公开(公告)日：2024-08-29
申请号：US18115766
申请日：2023-02-28
IPC分类号： H01R12/58
CPC分类号： H01R12/585
摘要： An improved solderless press-fit pin design capable of robustly mounting power semiconductor devices to printed circuit boards using ultrasonic welding thereby increasing manufacturing efficiency and lowering manufacturing temperatures and thus reducing the associated thermal stress to which the adjacent circuitry is exposed.
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公开(公告)号：US20230260874A1
公开(公告)日：2023-08-17
申请号：US18110363
申请日：2023-02-15
IPC分类号： H01L23/473
CPC分类号： H01L23/473
摘要： A high performance, low-profile semiconductor heat dissipation apparatus that is able to achieve increased heat dissipation efficiency, greater heat dissipation uniformity, and greater heat dissipation control through the use of multiple modes of innovative coolant fluid flow balancing.
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公开(公告)号：US20230260873A1
公开(公告)日：2023-08-17
申请号：US17672681
申请日：2022-02-15
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H05K7/20436 , H05K7/20945
摘要： A low profile semiconductor heat dissipation apparatus utilizing innovative three dimensional flow balancing to achieve both greater thermal efficiency and greater heat dissipation uniformity.
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