专利检索 ap:"Alden C. McLean" 第 1 页

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发明公开
MULTI-MODAL FLOW BALANCING FOR POWER SEMICONDUCTOR MODULE COOLING 审中-公开

公开(公告)号：US20230260874A1

公开(公告)日：2023-08-17

申请号：US18110363

申请日：2023-02-15

申请人： George R. Woody , David L. Bogdanchik , Alden C. McLean

发明人： George R. Woody , David L. Bogdanchik , Alden C. McLean

IPC分类号： H01L23/473

CPC分类号： H01L23/473

摘要： A high performance, low-profile semiconductor heat dissipation apparatus that is able to achieve increased heat dissipation efficiency, greater heat dissipation uniformity, and greater heat dissipation control through the use of multiple modes of innovative coolant fluid flow balancing.