A die seal ring structure includes a metal interconnect structure on a substrate, in which the metal interconnect structure includes an inter-metal dielectric (IMD) layer on the substrate and a first metal interconnection disposed in the IMD layer. Preferably, a first side of the first metal interconnection includes a comb-shape portion in a top view, a second side of the first metal interconnection includes a linear line, a third side of the first metal interconnection includes a linear line, and a fourth side of the first metal interconnection includes a linear line.