Invention Publication
- Patent Title: MANUFACTURING METHOD OF THERMAL PASTE
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Application No.: US17958025Application Date: 2022-09-30
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Publication No.: US20230264261A1Publication Date: 2023-08-24
- Inventor: Fei Lin YANG , Ing-Jer CHIOU
- Applicant: ASUSTEK COMPUTER INC.
- Applicant Address: TW Taipei
- Assignee: ASUSTEK COMPUTER INC.
- Current Assignee: ASUSTEK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Priority: TW 1105963 2022.02.18
- Main IPC: B22F9/08
- IPC: B22F9/08 ; B22F1/102 ; B22F1/105 ; B22F1/14

Abstract:
A manufacturing method of thermal paste is provided. The manufacturing method includes: providing a base material; heating a metal material to a liquid state, to generate a liquid metal material; sieving the liquid metal material to generate a metal powder material; adding a dispersant to the metal powder material and mixing to generate a mixed powder material; and mixing the mixed powder material and the base material.
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