公开(公告)号：US20230264261A1

公开(公告)日：2023-08-24

申请号：US17958025

申请日：2022-09-30

Applicant: ASUSTEK COMPUTER INC.

Inventor： Fei Lin YANG ,  Ing-Jer CHIOU

IPC: B22F9/08 ,  B22F1/102 ,  B22F1/105 ,  B22F1/14

CPC classification number: B22F9/08 ,  B22F1/102 ,  B22F1/105 ,  B22F1/14 ,  B22F2302/45 ,  B22F2301/30 ,  F28F2013/001

Abstract: A manufacturing method of thermal paste is provided. The manufacturing method includes: providing a base material; heating a metal material to a liquid state, to generate a liquid metal material; sieving the liquid metal material to generate a metal powder material; adding a dispersant to the metal powder material and mixing to generate a mixed powder material; and mixing the mixed powder material and the base material.