- 专利标题: DISTRIBUTED MULTI-DIE PROTOCOL APPLICATION INTERFACE
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申请号: US18299662申请日: 2023-04-12
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公开(公告)号: US20230289319A1公开(公告)日: 2023-09-14
- 发明人: Gary Brian Wallichs , Keith Duwel , Cora Lynn Mau
- 申请人: Altera Corporation
- 申请人地址: US CA San Jose
- 专利权人: Altera Corporation
- 当前专利权人: Altera Corporation
- 当前专利权人地址: US CA San Jose
- 主分类号: G06F13/42
- IPC分类号: G06F13/42 ; H04L69/14 ; G06F5/06
摘要:
Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
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