DISTRIBUTED MULTI-DIE PROTOCOL APPLICATION INTERFACE

    公开(公告)号:US20230289319A1

    公开(公告)日:2023-09-14

    申请号:US18299662

    申请日:2023-04-12

    IPC分类号: G06F13/42 H04L69/14 G06F5/06

    摘要: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.

    Multichip package with protocol-configurable data paths

    公开(公告)号:US11669479B2

    公开(公告)日:2023-06-06

    申请号:US17711860

    申请日:2022-04-01

    IPC分类号: G06F13/40 G06F13/42 G06F5/06

    摘要: Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include a substrate, a main die that is mounted on the substrate, and multiple transceiver daughter dies that are mounted on the substrate and that are coupled to the main die via corresponding Embedded Multi-die Interconnect Bridge (EMIB) interconnects formed in the substrate. Each of the main die and the daughter dies may include configurable adapter circuitry for interfacing with the EMIB interconnects. The adapter circuitry may include FIFO buffer circuits operable in a 1× mode or 2× mode and configurable in a phase-compensation mode, a clock-compensation mode, an elastic mode, and a register bypass mode to help support a variety of communications protocols with different data width and clocking requirements. The adapter circuitry may also include boundary alignment circuitry for reconstructing (de)compressed data streams.

    MULTICHIP PACKAGE WITH PROTOCOL-CONFIGURABLE DATA PATHS

    公开(公告)号:US20210109882A1

    公开(公告)日:2021-04-15

    申请号:US17131474

    申请日:2020-12-22

    IPC分类号: G06F13/40 G06F5/06 G06F13/42

    摘要: Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include a substrate, a main die that is mounted on the substrate, and multiple transceiver daughter dies that are mounted on the substrate and that are coupled to the main die via corresponding Embedded Multi-die Interconnect Bridge (EMIB) interconnects formed in the substrate. Each of the main die and the daughter dies may include configurable adapter circuitry for interfacing with the EMIB interconnects. The adapter circuitry may include FIFO buffer circuits operable in a 1× mode or 2× mode and configurable in a phase-compensation mode, a clock-compensation mode, an elastic mode, and a register bypass mode to help support a variety of communications protocols with different data width and clocking requirements. The adapter circuitry may also include boundary alignment circuitry for reconstructing (de)compressed data streams.

    Distributed multi-die protocol application interface

    公开(公告)号:US10936531B2

    公开(公告)日:2021-03-02

    申请号:US16792507

    申请日:2020-02-17

    摘要: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.

    DISTRIBUTED MULTI-DIE PROTOCOL APPLICATION INTERFACE

    公开(公告)号:US20200183877A1

    公开(公告)日:2020-06-11

    申请号:US16792507

    申请日:2020-02-17

    IPC分类号: G06F13/42 G06F5/06 H04L29/06

    摘要: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.

    Multichip package with protocol-configurable data paths

    公开(公告)号:US10394737B1

    公开(公告)日:2019-08-27

    申请号:US14975270

    申请日:2015-12-18

    摘要: Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include a substrate, a main die that is mounted on the substrate, and multiple transceiver daughter dies that are mounted on the substrate and that are coupled to the main die via corresponding Embedded Multi-die Interconnect Bridge (EMIB) interconnects formed in the substrate. Each of the main die and the daughter dies may include configurable adapter circuitry for interfacing with the EMIB interconnects. The adapter circuitry may include FIFO buffer circuits operable in a 1x mode or 2x mode and configurable in a phase-compensation mode, a clock-compensation mode, an elastic mode, and a register bypass mode to help support a variety of communications protocols with different data width and clocking requirements. The adapter circuitry may also include boundary alignment circuitry for reconstructing (de)compressed data streams.

    DISTRIBUTED MULTI-DIE PROTOCOL APPLICATION INTERFACE

    公开(公告)号:US20190179792A1

    公开(公告)日:2019-06-13

    申请号:US16208238

    申请日:2018-12-03

    IPC分类号: G06F13/42 G06F5/06 H04L29/06

    摘要: Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.