- 专利标题： EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR, MOLDING FILM AND SEMICONDUCTOR PACKAGE USING THE SAME
-
申请号： US18323562申请日： 2023-05-25
-
公开(公告)号： US20230295388A1公开(公告)日： 2023-09-21
- 发明人: Minsu JEONG , You Jin KYUNG , Byung Ju CHOI , Woo Jae JEONG , Kwang Joo LEE , Eunbyurl CHO
- 申请人： LG CHEM, LTD.
- 申请人地址： KR Seoul
- 专利权人： LG CHEM, LTD.
- 当前专利权人： LG CHEM, LTD.
- 当前专利权人地址： KR Seoul
- 优先权： KR 20180004041 2018.01.11 KR 20190001976 2019.01.07
- 分案原申请号： US16767808 2020.05.28
- 主分类号： C08J5/18
- IPC分类号： C08J5/18 ; C08G59/14 ; C08K3/36 ; H01L23/29
摘要：
The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.
公开/授权文献
- US3291136A Manufacture of cigarette-type smoking media 公开/授权日：1966-12-13
信息查询
