公开(公告)号：US20210155831A1

公开(公告)日：2021-05-27

申请号：US17045865

申请日：2019-06-17

Applicant: LG CHEM, LTD.

Inventor： Mi JANG ,  Sera KIM ,  Ji Ho HAN ,  Kwang Joo LEE ,  Bora YEON ,  Kwang Su SEO

IPC: C09J11/06 ,  C09J183/06

Abstract: The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.

公开(公告)号：US20210009867A1

公开(公告)日：2021-01-14

申请号：US17040180

申请日：2019-11-01

Applicant: LG CHEM, LTD.

Inventor： Wanjung KIM ,  Jong Min JANG ,  Byung Ju CHOI ,  Kwang Joo LEE

IPC: C09J133/08 ,  C09J163/04 ,  C08K3/22 ,  C08K5/5419 ,  C08K9/06 ,  H01L21/683 ,  H01L21/78

Abstract: The present invention relates to a resin composition for bonding semiconductors including two types of curing catalyst mixtures together with a heat dissipation filler in which a specific functional group is introduced onto the surface, an adhesive film for semiconductor produced therefrom, a dicing die bonding film and a method for dicing a semiconductor wafer.

公开(公告)号：US20190189304A1

公开(公告)日：2019-06-20

申请号：US16326073

申请日：2018-07-02

Applicant: LG CHEM, LTD.

Inventor： Woo Jae JEONG ,  You Jin KYUNG ,  Byung Ju CHOI ,  Bo Yun CHOI ,  Kwang Joo LEE ,  Min Su JEONG

IPC: H01B3/32 ,  H01L23/31 ,  H01L23/532 ,  H01L23/00

CPC classification number: H01B3/32 ,  H01B3/30 ,  H01L23/31 ,  H01L23/532 ,  H01L23/5329 ,  H01L24/07 ,  H01L2224/04105 ,  H01L2224/96

Abstract: The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.

公开(公告)号：US20180237667A1

公开(公告)日：2018-08-23

申请号：US15752666

申请日：2017-03-31

Applicant: LG CHEM, LTD.

Inventor： Jung Hak KIM ,  Hee Jung KIM ,  Se Ra KIM ,  Kwang Joo LEE ,  Seung Hee NAM ,  Young Kook KIM

IPC: C09J133/10 ,  C09J163/04 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065

CPC classification number: C09J133/10 ,  C08G59/621 ,  C09J163/00 ,  C09J163/04 ,  H01L21/565 ,  H01L23/3157 ,  H01L25/065 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/181 ,  H01L2924/00012 ,  C08L33/20

Abstract: The present invention relates to a semiconductor device including: a first semiconductor element fixed onto an adherend by flip-chip connection; an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; and a second semiconductor element connected to the first semiconductor element via the adhesive layer, wherein the adhesive layer has a predetermined melt viscosity and thixotropic index.

公开(公告)号：US20160336290A1

公开(公告)日：2016-11-17

申请号：US15030525

申请日：2015-11-17

Applicant: LG CHEM, LTD.

Inventor： Hee Jung KIM ,  Jung Hak KIM ,  Se Ra KIM ,  Kwang Joo LEE

IPC: H01L23/00 ,  C09J133/14 ,  C08L33/14 ,  C09J7/02

CPC classification number: H01L24/29 ,  C08L61/12 ,  C08L63/04 ,  C08L2201/08 ,  C08L2201/52 ,  C08L2203/16 ,  C08L2203/20 ,  C08L2205/03 ,  C09J5/00 ,  C09J7/21 ,  C09J7/22 ,  C09J7/35 ,  C09J7/38 ,  C09J133/068 ,  C09J133/14 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  C09J2433/00 ,  C09J2463/00 ,  H01L2224/2919 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/0665 ,  H01L2924/0675

Abstract: The present invention relates to an adhesive resin composition for bonding semiconductors, including: a (meth)acrylate-based resin including more than 17% by weight of (meth)acrylate-based repeating units containing epoxy-based functional groups; an epoxy resin having a softening point of more than 70° C; and a phenol resin having a softening point of more than 105° C, wherein the weight ratio of the (meth)acrylate-based resin is 0.48 to 0.65 relative to the total weight of the (meth)acrylate-based resin, the epoxy resin, and the phenol resin, an adhesive film for semiconductors obtained from the resin composition, a dicing die-bonding film including an adhesive layer that includes the adhesive film for semiconductors, a semiconductor wafer including the dicing die-bonding film, and a dicing method for the semiconductor wafer using the dicing die-bonding film.

Abstract translation: 本发明涉及一种用于接合半导体的粘合剂树脂组合物，其包括：（甲基）丙烯酸酯基树脂，其包含含有环氧基官能团的（甲基）丙烯酸酯系重复单元17重量％以上的（甲基）丙烯酸酯系树脂; 软化点大于70℃的环氧树脂; 和软化点大于105℃的酚醛树脂，其中（甲基）丙烯酸酯类树脂的重量比相对于（甲基）丙烯酸酯类树脂的总重量为0.48〜0.65，环氧树脂 ，酚醛树脂，由树脂组合物得到的半导体用粘合膜，包括具有半导体用粘合膜的粘合剂层的切割芯片接合膜，包括该切割芯片接合膜的半导体晶片和切割方法 对于使用切割芯片接合膜的半导体晶片。

公开(公告)号：US20240254372A1

公开(公告)日：2024-08-01

申请号：US18290527

申请日：2022-07-29

Applicant: LG CHEM, LTD.

Inventor： Hee SONG ,  Ji Ho HAN ,  Kwang Joo LEE

IPC: C09J11/06 ,  C08K5/315 ,  C08K5/3492 ,  C09J7/30 ,  C09J133/10 ,  H01L21/683

CPC classification number: C09J11/06 ,  C09J7/30 ,  C09J133/10 ,  H01L21/6836 ,  C08K5/315 ,  C08K5/3492 ,  C09J2301/408 ,  C09J2433/00

Abstract: An adhesive composition for a semiconductor process, a film for a semiconductor process comprising the same, and a method for manufacturing a semiconductor package using the same are provided. The adhesive composition provides the film for a semiconductor process having excellent adhesion reliability to a wafer even during a process of debonding a carrier from the wafer.

公开(公告)号：US20220186092A1

公开(公告)日：2022-06-16

申请号：US17598114

申请日：2020-08-13

Applicant: LG CHEM, LTD.

Inventor： Da Ae KIM ,  Ji Ho HAN ,  Kwang Joo LEE ,  Eun Yeong KIM ,  Mi JANG

IPC: C09J133/08 ,  C09J7/24 ,  C09J11/06 ,  H01L21/683

Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.

公开(公告)号：US20210032501A1

公开(公告)日：2021-02-04

申请号：US16966696

申请日：2019-04-11

Applicant: LG CHEM, LTD.

Inventor： Sera KIM ,  Ji Ho HAN ,  Mi JANG ,  Kwang Joo LEE

IPC: C09J7/24 ,  C09J133/14 ,  H01L21/683 ,  C09J7/40 ,  C09J7/25

Abstract: The present disclosure relates to an adhesive sheet for temporary attachment which is excellent in heat resistance and can realize sufficient adhesive strength even when being subjected to a high temperature process during the semiconductor production process, and can exhibit a sufficient reduction in adhesive strength due to photocuring in a peeling step, and a method for producing a semiconductor device using the same.

公开(公告)号：US20200369925A1

公开(公告)日：2020-11-26

申请号：US16959625

申请日：2019-01-11

Applicant: LG CHEM, LTD.

Inventor： Mi Seon YOON ,  Se Ra KIM ,  Kwang Joo LEE ,  Bora YEON ,  Sung Chan PARK ,  Eun Yeong KIM

IPC: C09J7/30 ,  C09J133/08 ,  C09J133/10 ,  C09J7/22 ,  H01L21/683

Abstract: The present invention relates to a back grinding tape including a polymer substrate and an adhesive layer, wherein the adhesive layer includes a (meth)acrylate resin containing 30 to 60% by weight of a repeating unit derived from a monomer or an oligomer having a glass transition temperature of 0° C. or higher, and wherein the adhesive layer has a glass transition temperature of −20° C. to 10° C., and a method of grinding wafers using the back grinding tape.

公开(公告)号：US20200211889A1

公开(公告)日：2020-07-02

申请号：US16626102

申请日：2018-08-30

Applicant: LG CHEM, LTD.

Inventor： Ji Ho HAN ,  Se Ra KIM ,  Mun Seop SONG ,  Kwang Joo LEE ,  Yeong Im YU

IPC: H01L21/683 ,  H01L21/78

Abstract: The present invention relates to a dicing die-bonding film including: a substrate; an antistatic layer formed on the substrate and including an aliphatic or alicyclic polyurethane resin and a conductive filler; a cohesive layer formed on the antistatic layer; and an adhesive layer formed on the cohesive layer, and a dicing method of a semiconductor wafer using the dicing die-bonding film.