公开(公告)号：US20210292618A1

公开(公告)日：2021-09-23

申请号：US17266864

申请日：2020-05-08

申请人： LG CHEM, LTD.

发明人： Youngsam KIM ,  You Jin KYUNG ,  Kwang Joo LEE ,  Minsu JEONG ,  Junghak KIM ,  Ju Hyeon KIM

IPC分类号： C09J163/04 ,  C09J7/10 ,  C09J11/08 ,  C09J11/04 ,  H01L23/00

摘要： The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.

公开(公告)号：US20210292616A1

公开(公告)日：2021-09-23

申请号：US17266023

申请日：2020-06-05

申请人： LG CHEM, LTD.

发明人： Junghak KIM ,  You Jin KYUNG ,  Kwang Joo LEE ,  Minsu JEONG ,  Ju Hyeon KIM ,  Youngsam KIM

IPC分类号： C09J163/00 ,  C09J183/06 ,  C09J11/04 ,  C09J11/06

摘要： The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

公开(公告)号：US20200347194A1

公开(公告)日：2020-11-05

申请号：US16767808

申请日：2019-01-09

申请人： LG CHEM, LTD.

发明人： Minsu JEONG ,  You Jin KYUNG ,  Byung Ju CHOI ,  Woo Jae JEONG ,  Kwang Joo LEE ,  Eunbyurl CHO

IPC分类号： C08J5/18 ,  C08K3/36 ,  C08G59/14 ,  H01L23/29

摘要： The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

公开(公告)号：US20230295388A1

公开(公告)日：2023-09-21

申请号：US18323562

申请日：2023-05-25

申请人： LG CHEM, LTD.

发明人： Minsu JEONG ,  You Jin KYUNG ,  Byung Ju CHOI ,  Woo Jae JEONG ,  Kwang Joo LEE ,  Eunbyurl CHO

IPC分类号： C08J5/18 ,  C08G59/14 ,  C08K3/36 ,  H01L23/29

CPC分类号： C08J5/18 ,  C08G59/14 ,  C08K3/36 ,  H01L23/295 ,  C08J2363/00 ,  C08K2201/003

摘要： The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.

公开(公告)号：US20210313290A1

公开(公告)日：2021-10-07

申请号：US16972528

申请日：2020-01-23

申请人： LG CHEM, LTD.

发明人： You Jin KYUNG ,  Minsu JEONG ,  Kwang Joo LEE

IPC分类号： H01L23/00

摘要： The present disclosure relates to a method for manufacturing a semiconductor package including vacuum-laminating a non-conductive film on a substrate on which a plurality of through silicon vias are provided and bump electrodes are formed, and then performing UV irradiation, wherein an increase in melt viscosity before and after UV irradiation can be adjusted to 30% or less, whereby a bonding can be performed without voids during thermo-compression bonding, and resin-insertion phenomenon between solders can be prevented, fillets can be minimized and reliability can be improved.