- 专利标题： TECHNIQUES FOR OPTICAL SUB-ASSEMBLY AND PACKAGING
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申请号： US18321380申请日： 2023-05-22
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公开(公告)号： US20230305245A1公开(公告)日： 2023-09-28
- 发明人: Zhizhong TANG , Wenjing LIANG , Kevin Kinichi MASUDA , Pradeep SRINIVASAN
- 申请人： AEVA, INC.
- 申请人地址： US CA Mountain View
- 专利权人： AEVA, INC.
- 当前专利权人： AEVA, INC.
- 当前专利权人地址： US CA Mountain View
- 主分类号： G02B6/42
- IPC分类号： G02B6/42 ; H01S5/024 ; H01L33/64
摘要：
A method of cooling an optical sub-assembly includes operating a diode mounted to a diode submount structure and cooling the diode with a thermoelectric cooler (TEC) in thermal contact with the diode, wherein the diode is positioned between the diode submount structure and the TEC.
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