专利检索 ap:("AEVA, INC.") AND inv:"Pradeep SRINIVASAN" 第 1 页

1.

发明公开
TECHNIQUES FOR OPTICAL SUB-ASSEMBLY AND PACKAGING 审中-公开

公开(公告)号：US20230305245A1

公开(公告)日：2023-09-28

申请号：US18321380

申请日：2023-05-22

申请人： AEVA, INC.

发明人： Zhizhong TANG , Wenjing LIANG , Kevin Kinichi MASUDA , Pradeep SRINIVASAN

IPC分类号： G02B6/42 , H01S5/024 , H01L33/64

CPC分类号： G02B6/4271 , H01S5/02415 , H01L33/645 , G02B6/43

摘要： A method of cooling an optical sub-assembly includes operating a diode mounted to a diode submount structure and cooling the diode with a thermoelectric cooler (TEC) in thermal contact with the diode, wherein the diode is positioned between the diode submount structure and the TEC.