- 专利标题： METHODS OF DETERMINING A HEIGHT, AND A HEIGHT PROFILE, OF A WIRE LOOP ON A WIRE BONDING MACHINE
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申请号： US18125152申请日： 2023-03-23
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公开(公告)号： US20230335532A1公开(公告)日： 2023-10-19
- 发明人: Basil Milton , Wei Qin , Zhijie Wang , Vladimir Pribula , Pavel Shusharin
- 申请人： Kulicke and Soffa Industries, Inc.
- 申请人地址： US PA For Washington
- 专利权人： Kulicke and Soffa Industries, Inc.
- 当前专利权人： Kulicke and Soffa Industries, Inc.
- 当前专利权人地址： US PA For Washington
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/66
摘要：
A method of determining a height value of a wire loop on a wire bonding machine is provided. The method includes the steps of: (a) imaging at least a portion of a wire loop using an imaging system on a wire bonding machine to detect a path of the portion of the wire loop; (b) moving a wire bonding tool towards a first contact portion of the wire loop in the path; (c) detecting when a portion of a conductive wire engaged with the wire bonding tool contacts the first contact portion of the wire loop; and (d) determining a height value of the wire loop at the first contact portion based on a position of the wire bonding tool when the portion of the conductive wire contacts the first contact portion of the wire loop.
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