公开(公告)号：US20180038806A1

公开(公告)日：2018-02-08

申请号：US15786669

申请日：2017-10-18

申请人： Kulicke and Soffa Industries, Inc.

发明人： Deepak Sood ,  Zhijie Wang ,  Thomas J. Colosimo, JR. ,  David A. Rauth ,  Shu-Guo Tang

IPC分类号： G01N21/95 ,  G01N21/84 ,  H01L23/00 ,  G06T7/00 ,  G01N21/88 ,  H01L21/66

CPC分类号： G01N21/9501 ,  G01N21/8422 ,  G01N21/8806 ,  G01N2021/8812 ,  G01N2021/8829 ,  G06T7/0006 ,  G06T2207/10152 ,  G06T2207/30148 ,  H01L22/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2731 ,  H01L2224/29012 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75901 ,  H01L2224/81203 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83908 ,  H01L2224/92125 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.

公开(公告)号：US20230335532A1

公开(公告)日：2023-10-19

申请号：US18125152

申请日：2023-03-23

申请人： Kulicke and Soffa Industries, Inc.

发明人： Basil Milton ,  Wei Qin ,  Zhijie Wang ,  Vladimir Pribula ,  Pavel Shusharin

IPC分类号： H01L23/00 ,  H01L21/66

CPC分类号： H01L24/85 ,  H01L22/20 ,  H01L2224/859 ,  H01L2224/85181

摘要： A method of determining a height value of a wire loop on a wire bonding machine is provided. The method includes the steps of: (a) imaging at least a portion of a wire loop using an imaging system on a wire bonding machine to detect a path of the portion of the wire loop; (b) moving a wire bonding tool towards a first contact portion of the wire loop in the path; (c) detecting when a portion of a conductive wire engaged with the wire bonding tool contacts the first contact portion of the wire loop; and (d) determining a height value of the wire loop at the first contact portion based on a position of the wire bonding tool when the portion of the conductive wire contacts the first contact portion of the wire loop.

公开(公告)号：US10352877B2

公开(公告)日：2019-07-16

申请号：US15786669

申请日：2017-10-18

申请人： Kulicke and Soffa Industries, Inc.

发明人： Deepak Sood ,  Zhijie Wang ,  Thomas J. Colosimo, Jr. ,  David A. Rauth ,  Shu-Guo Tang

IPC分类号： G01N21/95 ,  G01N21/88 ,  H01L21/66 ,  H01L23/00 ,  G06T7/00 ,  G01N21/84

摘要： A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.