Invention Publication
- Patent Title: RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
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Application No.: US18215863Application Date: 2023-06-29
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Publication No.: US20230341772A1Publication Date: 2023-10-26
- Inventor: Ken MARUYAMA
- Applicant: JSR CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 17081633 2017.04.17 JP 18056288 2018.03.23
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039 ; G03F7/16 ; G03F7/40 ; G03F7/20 ; G03F7/38 ; G03F7/32 ; C07C309/24 ; C07C309/06 ; C07C381/12 ; C07C309/12 ; C07C309/19 ; C07C303/32 ; G03F7/30

Abstract:
A radiation-sensitive resin composition includes: a base resin comprising a structure unit having an acid-dissociable group; and a radiation-sensitive acid generator which comprises compounds represented by formula (2) and formula (3), and optionally a compound represented by formula (1). R1-R3 are each independently a group having a cyclic structure. X11-X32 are each independently a hydrogen atom, a fluorine atom, or a fluorinated hydrocarbon group. At least one of X11 or X12, at least one of X21 or X22, and at least one of X31 or X32 are not a hydrogen atom, respectively. A11-A32 are each independently a hydrogen atom, or a hydrocarbon group having a carbon number of 1 to 20. The radiation-sensitive resin composition does not comprise a ketone-based solvent. The the radiation-sensitive resin composition does not comprise a monovalent onium cation other than an onium cation represented by formulas (X-1), (X-3), (X-4), or (X-5).
Information query
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