Invention Publication
- Patent Title: SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR DEPOSITION AND ETCH
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Application No.: US18342848Application Date: 2023-06-28
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Publication No.: US20230343552A1Publication Date: 2023-10-26
- Inventor: Khokan Chandra Paul , Ravikumar Patil , Vijet Patil , Carlaton Wong , Adam J. Fischbach , Timothy Franklin , Tsutomu Tanaka , Canfeng Lai
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/683 ; C23C16/509 ; C23C16/458 ; H01J37/32
Abstract:
Exemplary semiconductor substrate supports may include a pedestal shaft. The semiconductor substrate supports may include a platen. The platen may define a fluid channel across a first surface of the platen. The semiconductor substrate supports may include a platen insulator positioned between the platen and the pedestal shaft. The semiconductor substrate supports may include a conductive puck coupled with the first surface of the platen and configured to contact a substrate supported on the semiconductor substrate support. The semiconductor substrate supports may include a conductive shield extending along a backside of the platen insulator and coupled between a portion of the platen insulator and the pedestal shaft.
Information query
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