Invention Publication
- Patent Title: WHIPPED FORMULATIONS
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Application No.: US18124291Application Date: 2023-03-21
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Publication No.: US20230355485A1Publication Date: 2023-11-09
- Inventor: Stephen BALDWIN , Scott CARPENTER , Heidi GRAHAM , Nanhye KIM , Tom MEYER , David Reynolds , Jerry Vancleave , Eric DANN , Thomas DANN , Renee NELSON , Brian DANN
- Applicant: FORMULATED SOLUTIONS, LLC
- Applicant Address: US FL Largo
- Assignee: FORMULATED SOLUTIONS, LLC
- Current Assignee: FORMULATED SOLUTIONS, LLC
- Current Assignee Address: US FL Largo
- Main IPC: A61Q17/04
- IPC: A61Q17/04 ; A61Q11/00 ; A23P30/40 ; B65D83/62 ; A61K8/27 ; A61Q5/06 ; B65D83/20 ; A61K8/19 ; A61K8/04 ; A61Q19/00 ; A61Q7/00 ; B65D83/14 ; A61K9/12

Abstract:
The present disclosure relates to, inter alia, a formulation in a package. The formulation comprises one or more active agents and is co-mingled with a whipping agent prior to being filled under pressure into the package. The whipping agent is added in sufficient amounts to be dispersed in the formulation. The pressurized package is under sufficient pressure suitable to maintain the whipping agent dispersed in the formulation; and the pressurized package is under sufficient pressure to expel the formulation as a whipped formulation upon application of external force on the formulation in the package.
Public/Granted literature
- US12161737B2 Whipped formulations Public/Granted day:2024-12-10
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