- 专利标题： FILM FOR TEMPORARY FIXATION, LAYERED PRODUCT FOR TEMPORARY FIXATION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
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申请号： US18246855申请日： 2021-09-24
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公开(公告)号： US20230360947A1公开(公告)日： 2023-11-09
- 发明人: Yasuyuki OYAMA , Emi MIYAZAWA , Yuta AKASU , Shogo SOBUE
- 申请人： Resonac Corporation
- 申请人地址： JP Minato-ku, Tokyo
- 专利权人： Resonac Corporation
- 当前专利权人： Resonac Corporation
- 当前专利权人地址： JP Minato-ku, Tokyo
- 优先权： JP 20167739 2020.10.02
- 国际申请： PCT/JP2021/035169 2021.09.24
- 进入国家日期： 2023-03-28
- 主分类号： H01L21/683
- IPC分类号： H01L21/683
摘要：
A film for temporary fixing used for temporarily fixing a semiconductor member and a support member contains a curable resin component. The storage modulus at 270° C. after curing of the film for temporary fixing is 1.5 to 20 MPa. The storage modulus at 25° C. after curing of the film for temporary fixing is 1.5 to 150 MPa.
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