- 专利标题： MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT
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申请号： US18320102申请日： 2023-05-18
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公开(公告)号： US20230378146A1公开(公告)日： 2023-11-23
- 发明人: John Carlo Molina , Julian Carlo Barbadillo , Chun Ping Lo , Sylvester Ankamah-Kusi , Rajen Murugan , Thomas Kronenberg , Jonathan Noquil , Guangxu Li , Blake Travis , Jason Colte
- 申请人： Texas Instruments Incorporated
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 主分类号： H01L25/16
- IPC分类号： H01L25/16 ; H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L23/495 ; H01L21/48 ; H01L21/56
摘要：
An example microelectronic device package includes: a multilayer package substrate comprising routing conductors spaced by dielectric material, the multilayer package substrate having a device side surface and an opposing board side surface, and having a recessed portion extending from the device side surface and exposing routing conductors beneath the device side surface of the multilayer package substrate; a semiconductor die mounted to the device side surface of the multilayer package substrate and coupled to the routing conductors; a passive component mounted to the routing conductors exposed in the recessed portion of the multilayer package substrate; and mold compound covering the semiconductor die, the passive component, and a portion of the multilayer package substrate.
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