- 专利标题: Liquid cooling high-density pluggable modules for a network element
-
申请号: US17941140申请日: 2022-09-09
-
公开(公告)号: US20230039781A1公开(公告)日: 2023-02-09
- 发明人: Behzad Mohajer , Terence Graham , Peter Ajersch , Bonnie L. Mack , Marko Nicolici , Michael Bishop , Kamran Rahmani , Simon J. Shearman , Daniel Rivaud
- 申请人: Ciena Corporation
- 申请人地址: US MD Hanover
- 专利权人: Ciena Corporation
- 当前专利权人: Ciena Corporation
- 当前专利权人地址: US MD Hanover
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.
公开/授权文献
信息查询