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    Liquid cooling high-density pluggable modules for a network element
    3.
    发明申请
    Liquid cooling high-density pluggable modules for a network element 有权

    公开(公告)号：US20210112683A1

    公开(公告)日：2021-04-15

    申请号：US17071073

    申请日：2020-10-15

    申请人： Ciena Corporation

    发明人： Behzad Mohajer ,  Terence Graham ,  Peter Ajersch ,  Bonnie L. Mack ,  Marko Nicolici ,  Michael Bishop ,  Kamran Rahmani ,  Simon J. Sherman

    IPC分类号： H05K7/20

    摘要： A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.

    Hardened optical platform with pluggable optics
    4.
    发明申请
    Hardened optical platform with pluggable optics 审中-公开

    公开(公告)号：US20200100386A1

    公开(公告)日：2020-03-26

    申请号：US16137123

    申请日：2018-09-20

    申请人： Ciena Corporation

    发明人： Peter Saturley ,  Terence Graham

    IPC分类号： H05K7/20 ,  H05K7/10 ,  H05K7/02 ,  H05K5/00 ,  G02B6/44

    摘要： A module in a hardened optical platform includes one or more Printed Circuit Boards (PCB) and associated components; at least one cage configured to receive a pluggable optical module, wherein the at least one cage is on a PCB of the one or more PCBs; and a housing enclosing the one or more PCBs, wherein the housing covers the one or more PCBs, the associated components, and the at least one cage with the pluggable optical module, with respect to airflow, wherein a thermally conductive conduit is formed between the pluggable optical module once inserted and the housing, enabling the pluggable optical module to operate in the housing which is sealed with respect to airflow.

    SECONDARY SIDE HEATSINK TECHNIQUES FOR OPTICAL AND ELECTRICAL MODULES
    6.
    发明申请
    SECONDARY SIDE HEATSINK TECHNIQUES FOR OPTICAL AND ELECTRICAL MODULES 有权

    公开(公告)号：US20210084746A1

    公开(公告)日：2021-03-18

    申请号：US16571722

    申请日：2019-09-16

    申请人： Ciena Corporation

    发明人： Mitchell O'Leary ,  Victor Aldea ,  Kamran Rahmani ,  Trevor Meunier ,  Peter Ajersch ,  Terence Graham ,  Marc Leclair

    IPC分类号： H05K1/02 ,  H05K1/18

    摘要： A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

    Pluggable optical module thermal management and heat shield assemblies, devices, and methods
    7.
    发明授权
    Pluggable optical module thermal management and heat shield assemblies, devices, and methods 有权

    公开(公告)号：US10935742B2

    公开(公告)日：2021-03-02

    申请号：US16653248

    申请日：2019-10-15

    申请人： Ciena Corporation

    发明人： Eric Maniloff ,  Victor Aldea ,  Terence Graham ,  Bonnie Lynne Mack

    IPC分类号： G02B6/42

    摘要： The present disclosure provides pluggable optical modules that are prevented from reaching potentially dangerous temperatures when a fiber optic connector is not present and engaged with the associated module housing. Further, the present disclosure provides fiber optic connectors and/or pluggable optical modules that incorporate a port heat shield external to the associated face plate when the pluggable optical modules and fiber optic connectors are engaged, thereby preventing a user from contacting potentially hot and dangerous metallic surfaces of the module housings, as well as providing access for cooling air flow. The solutions presented herein are equally applicable to fixed optical ports and connectors as well.

    Secondary Side Heatsink Techniques for Optical and Electrical Modules
    9.
    发明申请
    Secondary Side Heatsink Techniques for Optical and Electrical Modules 有权

    公开(公告)号：US20220352651A1

    公开(公告)日：2022-11-03

    申请号：US17761036

    申请日：2020-09-09

    申请人： Ciena Corporation

    发明人： Mitchell O'Leary ,  Victor Aldea ,  Kamran Rahmani ,  Trevor Meunier ,  Peter Ajersch ,  Terence Graham ,  Marc Leclair

    IPC分类号： H01R4/48 ,  H01R4/30

    摘要： A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.

    Pluggable optical module thermal management and heat shield assemblies, devices, and methods
    10.
    发明申请
    Pluggable optical module thermal management and heat shield assemblies, devices, and methods 审中-公开

    公开(公告)号：US20200271877A1

    公开(公告)日：2020-08-27

    申请号：US16287266

    申请日：2019-02-27

    申请人： Ciena Corporation

    发明人： Eric Maniloff ,  Victor Aldea ,  Terence Graham ,  Bonnie Lynne Mack

    IPC分类号： G02B6/42

    摘要： The present disclosure provides pluggable optical modules that are prevented from reaching potentially dangerous temperatures when a fiber optic connector is not present and engaged with the associated module housing. Further, the present disclosure provides fiber optic connectors and/or pluggable optical modules that incorporate a port heat shield external to the associated face plate when the pluggable optical modules and fiber optic connectors are engaged, thereby preventing a user from contacting potentially hot and dangerous metallic surfaces of the module housings, as well as providing access for cooling air flow. The solutions presented herein are equally applicable to fixed optical ports and connectors as well.